This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging.
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This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging.
Read Less
Add this copy of 3d Microelectronic Packaging to cart. $153.69, new condition, Sold by Basi6 International rated 5.0 out of 5 stars, ships from Irving, TX, UNITED STATES, published 2021 by Springer Verlag, Singapore.
Add this copy of 3d Microelectronic Packaging to cart. $153.69, new condition, Sold by Basi6 International rated 5.0 out of 5 stars, ships from Irving, TX, UNITED STATES, published 2020 by Springer.
Add this copy of 3D Microelectronic Packaging: From Architectures to to cart. $187.87, new condition, Sold by Ingram Customer Returns Center rated 5.0 out of 5 stars, ships from NV, USA, published 2020 by Springer.
Add this copy of 3D Microelectronic Packaging: From Architectures to to cart. $188.83, new condition, Sold by GreatBookPrices rated 4.0 out of 5 stars, ships from Columbia, MD, UNITED STATES, published 2020 by Springer.
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New. Sewn binding. Cloth over boards. 622 p. Contains: Unspecified, Illustrations, black & white, Illustrations, color, Tables, color. Springer Advanced Microelectronics, 64. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers.
