Add this copy of Electronics Packaging Forum: Multichip Module to cart. $11.00, very good condition, Sold by Book Bear rated 5.0 out of 5 stars, ships from West Brookfield, MA, UNITED STATES, published 1994 by IEEE Press.
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Very Good in Printed Boards jacket. 8vo-over 7¾"-9¾" tall. 392 pp. Tightly bound. Corners not bumped. Text is free of markings. No ownership markings. Published without dust jacket. Printed boards.
Add this copy of Electronics Packaging Forum: Multichip Module to cart. $11.97, very good condition, Sold by ThriftBooks-Reno rated 4.0 out of 5 stars, ships from Reno, NV, UNITED STATES, published 1993 by IEEE.
Add this copy of Electronics Packaging Forum: Multichip Module to cart. $41.26, good condition, Sold by Bonita rated 4.0 out of 5 stars, ships from Santa Clarita, CA, UNITED STATES, published 1994 by IEEE.
Add this copy of Electronics Packaging Forum-Multichip Module Technology to cart. $68.67, new condition, Sold by Educational Media Centre rated 4.0 out of 5 stars, ships from New Delhi, DELHI, INDIA, published 1993 by Institute of Electrical & Electronics Engineers(IEEE).
Edition:
1993, Institute of Electrical & Electronics Engineers(IEEE)
Add this copy of Electronics Packaging Forum-Multichip Module Technology to cart. $70.42, new condition, Sold by Basi6 International rated 5.0 out of 5 stars, ships from Irving, TX, UNITED STATES, published 1993 by Institute of Electrical & Electronics Engineers(IEEE).
Edition:
1993, Institute of Electrical & Electronics Engineers(IEEE)
Add this copy of Electronics Packaging Forum-Multichip Module Technology to cart. $70.64, new condition, Sold by discount_scientific_books rated 5.0 out of 5 stars, ships from Sterling Heights, MI, UNITED STATES, published 1993 by Institute of Electrical & Electronics Engineers(IEEE).
Edition:
1993, Institute of Electrical & Electronics Engineers(IEEE)
Add this copy of Electronics Packaging Forum-Multichip Module Technology to cart. $71.42, new condition, Sold by Basi6 International rated 5.0 out of 5 stars, ships from Irving, TX, UNITED STATES, published 1993 by Institute of Electrical & Electronics Engineers(IEEE).
Edition:
1993, Institute of Electrical & Electronics Engineers(IEEE)
