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3d Microelectronic Packaging
2018, Springer
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3319830864
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3319830864
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3319830864
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3D Microelectronic Packaging: From Fundamentals to Applications
by Li, Yan (Editor), and Goyal, Deepak (Editor)
2018, Springer
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9783319830865
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3319830864
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Seller's Description: New. Trade paperback (US). Glued binding. 463 p. Contains: Unspecified, Illustrations, black & white, Illustrations, color. Springer Advanced Microelectronics, 57.
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